device replication and assembly
SUBLYM HOT
EMBOSSING MACHINE
The Sublym hot embossing machine is the first portable plug-&-play hot embossing machine on the market. It is also dramatically cheaper than classic hot embossing machines priced in the range of hundreds of thousands of dollars.
DEVICE REPLICATION AND ASSEMBLY
SUBLYM HOT EMBOSSING MACHINE
The Sublym hot embossing machine is the first portable plug-&-play hot embossing machine on the market. It is also dramatically cheaper than classic hot embossing machines priced in the range of hundreds of thousands of dollars.
Sublym - Alternative To Soft-lithography
Sublym Hot Embossing – Alternative to Soft-lithography
The Sublym100 is a great alternative to soft-lithography microfabrication, for easy and quick production of your microfluidic devices.
The SuBlym100 is a hot embossing machine, using heat and pressure to mold a variety of materials in a matter of minutes. More specifically, it has been optimized for Flexdym polymer molding in only 2 minutes, but can also be used to mold various other thermoplastics, including PMMA.
Do you require an alternative to soft-lithography microfabrication? Because the Sublym™ hot embossing machine is a great option for easy and quick production of microfluidic chips.
The Sublym™ is a hot embossing machine, using heat and pressure to mold a variety of materials in a matter of minutes, including Flexdym™, COC, PMMA and PS. Consequently, it serves as a great alternative to soft-lithography casting. More specifically, the Sublym100 has been optimized for Flexdym™ polymer molding in only 2 minutes, but it can also be used to mold various other thermoplastics, including PMMA.
Check out below additional advantages of the Sublym™:
- Easy-to-use, with no extensive training is needed to operate it. The Sublym™ is the perfect equipment for accelerating projects.
- An ultra-compact design, that’s not much bigger than a laptop. The Sublym™ is dramatically smaller than standard commercial hot embossing machines, weighing up to 500 kg.
- A user-friendly system, that is only powered by electricity. You can plug-and-play in the smallest of spaces.
- Dramatically cheaper than other microfabrication equipment. The Sublym™ makes microfluidics more accessible to everyone.
4 Easy steps to create Flexdym chips using the Sublym™:
- Cut a Flexdym™ sheet to the size of your device.
- Next, mold the sheet by placing the sheet, between your mold and the counter mold (included in the Sublym kit), inside the machine.
- Then, unmold the sheet and create inlet/outlet ports. Check out our metal punch pliers for this step.
- Finally, laminate sheet onto substrate. Flexdym™ can bond to various materials including, itself, glass, PDMS, PS, PC, COC, COP and PMMA.
A note to our Flex users: the Sublym also serves a great bonding aid for standardized Flexdym™ chip bonding.
This microfabrication countertop companion allows quick prototyping and production of microfluidic chips at a push of a button! What else could you need?
Want to find out more on what types of molds to use in hot embossing? Check out our Epoxym™ kit, solution for replicating molds.
And make sure to follow us on LinkedIn and Youtube to get all our current news.
| Dimension | 33 x 34 x 11 cm3 |
|---|---|
| Molding size | Up to 4" in diameter (Suitable for multiple microscope slide molding) |
| Max Mold Thickness | 1cm (Opt:1.5cm) |
| Temperature | 50°C – 180°C |
| Temperature Ramp | 180°C / 5min |
| Approximate Force | 1.2kN to 1.8kN |
| Power | 800W |
| Heat Resistant Gloves Size | Small, Medium, Large |
Sublym Hot Embossing Machine
The Sublym vs. A Hot Press
Sublym Machine
Optimized for Flexdym molding in only 1-2 minutes!
Compact & User-friendly design that requires little to no training.
Dramatically cheaper than most standard clean room equipment. This small investment is an opportunity for you to begin exploring microfluidics. Read more
Classic Hot Press
Not optimized for Flexdym molding, therefore longer molding time.
Less easy-to-use alternative for the Sublym.
Slightly more expensive than the Sublym100, but a standard piece of equipment which is generally installed in fabrication facilities.
The Sublym vs. A Hot Press
Sublym Machine
Optimized for Flexdym molding in only 1-2 minutes!
Compact & User-friendly design that requires little to no training.
Dramatically cheaper than most standard clean room equipment. This small investment is an opportunity for you to begin exploring microfluidics. Read more
CLASSIC HOT PRESS
Not optimized for Flexdym molding, therefore longer molding time.
Less easy-to-use alternative for the Sublym.
Slightly more expensive than the Sublym100, but a standard piece of equipment which is generally installed in fabrication facilities.
Eden Tech Youtube Channel
Videos & tips demonstrating how easy it is to to use all our products! Find step-by-step explanations on a variety of topics including:
Flexdym Bonding
Flexdym Molding
Flexdym 3D Printing
Sublym for Thermoplastics
Sublym Program Setup
Epoxym kit steps
and more…
Eden Tech Youtube Channel
Videos & tips demonstrating how easy it is to to use all our products! Find step-by-step explanations on a variety of topics including:
Flexdym Bonding
Flexdym Molding
Flexdym 3D Printing
Sublym for Thermoplastics
Sublym Program Setup
Epoxym kit steps
and more…
Sublym Molding Protocol
STEP BY STEP
Flexdym Devices Using Sublym
01
Cut a Flexdym sheet
02
Mold in 2 minutes using the Sublym
03
Create inlet/outlet ports
04
Bond Flexdym to substrate
STEP BY STEP
Flexdym Devices Using Sublym
01
Cut a Flexdym sheet
02
Mold using the Sublym
03
Create inlet/outlet ports
04
Bond to substrate
different MOLDS FOR
Hot Embossing
Epoxy Resin Mold
One of the the best options for hot embossing, remains robust through repeated molding cycles. Our Epoxym kit enables the fabrication of epoxy mold replicas from Silicon wafers. Read more
Glass Mold
Etched glass molds are another robust option for hot embossing.
Metal Mold
Metal molds, such as those made from aluminium, are a robust option.
Silicon Wafer
The least ideal option for hot embossing are SU-8 & silicon wafers, due to their fragility and ease of breakage. However, when carefully handled and coated with non-stick spray, they may do the trick.
different MOLDS FOR
Hot Embossing
Epoxy Resin Mold
One of the the best options for hot embossing, remains robust through repeated molding cycles. Our Epoxym kit enables the fabrication of epoxy mold replicas from Silicon wafers. Read more
Glass Mold
Etched glass molds are another robust option for hot embossing.
Metal Mold
Metal molds, such as those made from aluminium, are a robust option.
Silicon Wafer
The least ideal option for hot embossing are SU-8 & silicon wafers, due to their fragility and ease of breakage. However, when carefully handled and coated with non-stick spray, they may do the trick.
Sublym Advantages for Academic Research
Sublym Advantages for Industry
Who Are Sublym Users?
Eden Materials Flexdym Clients...
Eden Materials Flexdym Clients...
How sublym Kit Shipping works
Order
The product is available to pre-order at four week time increments.
Production
After this time, the orders will start to be produced during a two week period, and new orders will be added to the same shipment while stock is available.
Shipment
At this stage, items are shipped, usually taking a few working days to arrive, depending on client location.
Brochures & Documents
Flexdym is our original and patented material, developed by our CEO Emmanuel Roy. Unlike other materials used in microfluidics device fabrication, Flexdym is the first material created specifically for microfluidics biomedical applications. Our Sublym hot embossing machine was then created to render device replication fast and easy. It is compact, user-friendly and affordable. Finally, our Epoxym kit produces robust mold replicas from silicon wafer molds. For more information on any of these products, check out our brochures below.
Scientific Publications
Flexdym users worldwide are publishing their microfluidics research in top peer reviewed journals including, Nature, Advanced Materials, Analytical Chemistry, Lab on Chip and more. The topics also vary from cell culture and point of care diagnostics, to flexible electronics, wearable devices and micromixers. For a copy of our publications contatc us below!
Eden Tech
Headquarters:
11 Rue de Lourmel
Paris 75015, France
Client Facing Offices:
4 Rue de Rambervillers
Paris 75012, France
EDEN TECH
Headquarters:
11 Rue de Lourmel
Paris 75015, France
Client Facing Office:
4 Rue de Rambervillers,
Paris 75012, France
Trademark Flexdym and Sublym – EU.IP Offices.
