Core Products > Support
Improved Supporting Documents
During our transformation from Eden Microfluidics to Eden Tech, we wanted to dedicate special focus to improving our customer service and support. Therefore, we have designed and created new documents to help you understand our technologies. These supporting documents for our Eden Materials and Eden Lab clients include:
Chapter 15, Intech Open (2016)
Lab on a Chip Issue 2 Vol 15, 406-416 (2015) DOI:10.1039/C4LC00947A
Eden Materials FAQ
Flexdym is a clear, thermoplastic elastomer that is certified biocompatible and serves as a great alternative to PDMS. Moreover, it has the advantage of being compatible with both small scale and large scale manufacturing methods of hot embossing and injection molding, respectively.
While Flexdym is less permeable than PDMS, it still has sufficient air permeability to sustain cell cultures. Flexdym grades have successfully been used for neurons, hepatocytes, endothelial, dermal, stem-cells and IPSCs cells cultures among others. Flexdym is UPS Class VI and ISO 10993-5 biocompatible certified material (PVC, Latex and others phthalates free).
Yes, Flexdym is a transparent material and can be used with a broad range of fluorophores. See UV-vis transmittance spectra on the Flexdym brochure.
In its pristine state, Flexdym is moderately hydrophobic. To achieve stable hydrophilic surfaces strategies that have been used on hard plastics can also be applied to Flexdym surfaces. These strategies include plasma treatment or coatings with hydrophilic materials, such as poly (vinyl alcohol), polyurethane, polyacrylate, (hydroxypropyl) methyl cellulose, polyvinylpyrrolidone, or hyaluronic acid. Multiple vendors offer hydrophilic coatings through licensing models or outsourcing. See our Lab on Chip 2017 ref. DOI above).
Isopropyl alcohol, methanol or distilled water may be used. Flexdym has to be dry (air or hoven dried) before molding to avoid bubbling or splays (cloudiness). Tape is also recommended to remove dust particles. We recommend working with Flexdym in a clean room or under a laminar hood to minimize particle contamination.
Ethylene oxide or gamma irradiation.
- Rapid and easy molding
- No use of harsh chemicals
- No treatment bonding from room temperature and upwards
- Easy bonding via lamination
- Easy to upscale because it is Compatible with industrial production technologies
Flexdym hydrophilicity is more stable than that of PDMS. See the Lab on Chip 2017 article, DOI ref.
Flexdym displays lower absorption properties than PDMS. See our 2017 Lab on Chip article for experimental results.
We would recommend using a die cutting method, as laser methods may require lab-dependent process development and optimization.
Flexdym has 2 years shelf life warranty.
Flexdym is around 40-50 times less permeable to gases than PDMS.
Yes, most heat presses or hot-embossers should work. A press that can mold at a pressure of at least 5 psi (Bar?) or above is ideal (a vacuum assisted press is not required). You may have to make small adjustments to optimize molding your chips. We offer a compact microfabrication kit, user friendly and plug and play system.
Flexdym is molded using the hot embossing, therefore it has high replication fidelity like other thermoplastics. The size of features is limited by mold features. Sub 100 nm resolution features have been acheived with this technique.
A variety of molds can be used for Flexdym molding.
Classic SU-8 and silicon wafer molds may be used with the help of anti-sticking treatments, such as Optool(TM) or other fluorinated coatings. To facilitate and increase the robustness of the hot embossing process we recommend using monolithic epoxy molds with no treatment required. If you are interested in this alternative, please see our epoxym kit FAQ below.
Other molds which can be used include, metallic molds (aluminum, nickel, or brass), glass, and PDMS.
See Flexdym brochure above.
Flexdym is a material that can bond with microfluidics thermoplastics and other materials, such as PC, POC, PS, PP or glass, Si.
Flexdym is a type of non-reactive adhesive (similar to PSA materials) that can be bond to substrates via simple lamination. There is a conformable contact, as seen with PDMS. No solvent, water, or heat is needed for this process (although it can enhance and accelerate bonding). Depending on the substrate, Flexdym can sustain fluidic pressures up to 7 bar.
It can be bonded at room temperature (up to a few hours). To reduce the time of bonding, a thermal bonding process can be used for 30-60 min (maximum 90°C). Room temperature bonding opens opportunities for biological functionalization of the device.
We recommend the use of metal hole punch pliers., a similar and more robust alternative to biopsy hole punches. We provide metal punch pliers, as well as luer lock connector kits we have developed to ensure easy and leak-free connections with any tubing.
Our team has created luer lock connector kits, containing luer lock connectors and o-ring adhesives tested for cytotoxicity.
Sublym Microfabrication Machine
The Sublym is a hot embossing machine developed by our team to mold Flexdym within a few minutes. It is a user-friendly and compact system that requires to special training and fits on any small benchtop space. The Sublym is up to 100-1000 x cheaper than other commercially available microfabrication embossing machines.
The basic model includes 5″ frame in order to support up to 4″ mold wafers. Customized mold frames may be available at request (single or multiple mold integration).
Yes. We have initial results showing the Sublym can sucessfully mold other thermoplastics, such as PMMA.
Epoxym Mold Making
Our Epoxym kit allows you to make epoxy resin mold replicas from any master mold. The kit first converts the master into a PDMS negative of the design. The PDMS intermediate mold is then used to fabricate a replica epoxy mold that can be used up to hundreds of hot embossing cycles.
Alternatively we also provide a replica mold service, where you can send us your photomask and we produce epoxy mold replicas for you to use.
Yes, the Epoxym kit provides several advantages to the PDMS soft lithography process, such as providing a cleaner working environment, decreases loss of material, and producing calibrated chips.
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Paris 75015, France
Client Facing Offices:
172 Rue de Charonne
Paris 75011, France
Trademark Flexdym and Sublym – EU.IP Offices.