Epoxym Kit: Mold Replication Solution
Produce robust epoxy molds replicas that offer a superior experience to classic SU-8 & silicon masters. Now you can increase the molding throughput of all your devices, while increasing the life-span of you silica wafers.
Epoxym Kit – Microfluidics Mold Solution
Are you searching for an alternative microfluidics mold solution to your fragile silicon wafers?
In microfabrication techniques such as hot embossing, it is imperative to have a robust mold to withstand the mechnical stress applied during molding and unmolding. That’s why we created the EpoxymTM kit.
What Does the Epoxym Kit Do?
It is a multifunctional and easy-to-use microfluidics mold solution system that replicates fragile silicon molds into robust epoxy resin molds. Once the silicon wafer is replicated, then it can be safely tucked away and excluded from your routine fabrication. This preserves your fragile and valuable master mold manufactured by microfabrication techniques (e.g. SU8 photolithography, DRIE etching, etc).
The high temperature resistant epoxy molds are robust and less likely to break during microfabrication methods such as hot embossing. This can consequently save you time and money, especially if you do not have direct access to mold fabrication equipment or have a limited budget.
How Does It Work?
The Epoxym kit creates replicate molds through a two-step casting system:
1. First fabricate a negative mold in PDMS
2. Next, use the PDMS intermmediate to fabricate the final replica epoxy mold suitable for hot embossing (see our Sublym™ machine for molding within minutes).
The Epoxym it includes a frame system designed for the replication of 4-inch master mold wafers. The frame is adjustable to different heights, using screws and a latch mechanism. It is also accompanied by a valve and tubing, which permits the entire system to be connected to a vaccum pump (not included in the kit).
Therefore, the Epoxym microfluidics mold solution creates ideal molds for molding FlexdymTM and other materials through hot embossing. To find out more about these solutions please refer to our Epoxym brochure and Epoxym user guide.
16 x 23 x 6.5 cm3
6mm rigid tubing
AI and FKM
|Max Master Size Config. A||
Up to 4" in diam.
|Max Master Thick. Config. A||
|Operating Temp. Config. A||
0°C to 90°C
|Countermold Thick Config. B||
3 to 7 mm
|Operating Temp. Config. B||
0°C to 140°C
Epoxym Kit Components
The Epoxym microfluidics mold solution is a multi-functional and easy-to-use system to replicate molds. This solution is designed to help preserve your fragile and valuable silicon master wafer mold, by producing epoxy resin replicas. These replicas are more robust and can then be used numerous times whilst avoiding breaking. The two-step system involves the fabrication of an intermediate countermold in silicone, which is then used to replicate the master into a high temperature resistant Epoxym mold suitable for hot embossing.
The mold frame is composed of two parts: the base/bottom of the frame and the lid of the frame. The base contains a small hole in its center, allowing for a vacuum seal to be created during the molding process. The vacuum can be controlled using a vacuum valve. The lid contains a large circle opening at its center, to enable casting of the mold. The entire system has an adaptor connecting the frame to the vacuum pump tubing.
Epoxy Resin Components
Create monolithic & mobust mold using our carefully selected epoxy resin. It has high replication fidelity (0.2 μm) and high temperature resistance (180°C).
Epoxym Kit 2-Step Protocol
SU-8 & Silicon Wafer
Final Epoxy Resin Mold
Pattern is created using SU-8 and standard photolithography techniques.
PDMS is cast on the silicon SU-8 mastermold & baked.
Epoxym resin is poured on PDMS mold. Final Epoxym replica mold baked & ready.
Advantages of Epoxym Resin Mold
Epoxym Kit Latch Mechanism
Epoxym Kit Casting
Eden Tech Youtube Channel
Videos & tips demonstrating how easy it is to to use all our products! Find step-by-step explanations on a variety of topics including:
Flexdym 3D Printing
Sublym for Thermoplastics
Sublym Program Setup
Epoxym kit steps
Brochures & Documents
Flexdym is our original and patented material, developed by our CEO Emmanuel Roy. Unlike other materials used in microfluidics device fabrication, Flexdym is the first material created specifically for microfluidics biomedical applications. Our Sublym hot embossing machine was then created to render device replication fast and easy. It is compact, user-friendly and affordable. Finally, our Epoxym kit produces robust mold replicas from silicon wafer molds. For more information on any of these products, check out our brochures below.
11 Rue de Lourmel
Paris 75015, France
Client Facing Offices:
4 Rue de Rambervillers
Paris 75012, France
Trademark Flexdym and Sublym – EU.IP Offices.