mold replication unit

EPOXYM MOLD
SOLUTION

The Epoxym mold replication solution provides innovators at the initial stages of device development, with low-cost molds for routine device replication.

MOLD REPLICATION UNIT

EPOXYM MOLD SOLUTION

The Epoxym mold replication solution provides innovators at the initial stages of device development, with low-cost molds for routine device replication.

MOLD REPLICATION UNIT

EPOXYM MOLD
SOLUTION

The Epoxym mold replication solution provides innovators at the initial stages of device development, with low-cost molds for routine device replication.

Epoxym Kit: Mold Replication Solution

Produce robust epoxy molds replicas that offer a superior experience to classic SU-8 & silicon masters. Now you can increase the molding throughput of all your devices, while increasing the life-span of you silica wafers.

SKU: EM0002 Category:

Epoxym Kit – Microfluidics Mold Solution

Are you searching for an alternative microfluidics mold solution to your fragile silicon wafers?

In microfabrication techniques such as hot embossing, it is imperative to have a robust mold to withstand the mechnical stress applied during molding and unmolding. That’s why we created the EpoxymTM kit.

What Does the Epoxym Kit Do?

 

It is a multifunctional and easy-to-use microfluidics mold solution system that replicates fragile silicon molds into robust epoxy resin molds. Once the silicon wafer is replicated, then it can be safely tucked away and excluded from your routine fabrication. This preserves your fragile and valuable master mold manufactured by microfabrication techniques (e.g. SU8 photolithography, DRIE etching, etc).

The high temperature resistant epoxy molds are robust and less likely to break during microfabrication methods such as hot embossing. This can consequently save you time and money, especially if you do not have direct access to mold fabrication equipment or have a limited budget.

How Does It Work?

 

The Epoxym kit creates replicate molds through a two-step casting system:
1. First fabricate a negative mold in PDMS
2. Next, use the PDMS intermmediate to fabricate the final replica epoxy mold suitable for hot embossing (see our Sublym™ machine for molding within minutes).

The Epoxym it includes a frame system designed for the replication of 4-inch master mold wafers. The frame is adjustable to different heights, using screws and a latch mechanism. It is also accompanied by a valve and tubing, which permits the entire system to be connected to a vaccum pump (not included in the kit).

Therefore, the Epoxym microfluidics mold solution creates ideal molds for molding FlexdymTM  and other materials through hot embossing. To find out more about these solutions please refer to our Epoxym brochure and Epoxym user guide.

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Dimension

16 x 23 x 6.5 cm3

Vacuum inlet

6mm rigid tubing

Wetted Materials

AI and FKM

Weight

1.35 Kg

Max Master Size Config. A

Up to 4" in diam.

Max Master Thick. Config. A

8 mm

Operating Temp. Config. A

0°C to 90°C

Countermold Thick Config. B

3 to 7 mm

Operating Temp. Config. B

0°C to 140°C

01

EPOXYM FRAME

Epoxym Kit Component

The mold frame is composed of two parts: the base/bottom of the frame and the lid of the frame. The base contains a small hole in its center, allowing for a vacuum seal to be created during the molding process. The vacuum can be controlled using a vacuum valve. The lid contains a large circular opening at its center, to enable the casting of the mold. The entire system has an adaptor connecting the frame to the vacuum pump tubing.

02

EPOXY RESIN

Epoxym Kit Component

Create monolithic & mobust mold using our carefully selected epoxy resin. It has high replication fidelity (0.2 μm) and high temperature resistance  (180°C).

01

EPOXYM FRAME

Epoxym Kit Component

The mold frame is composed of two parts: the base/bottom of the frame and the lid of the frame. The base contains a small hole in its center, allowing for a vacuum seal to be created during the molding process. The vacuum can be controlled using a vacuum valve. The lid contains a large circle opening at its center, to enable casting of the mold. The entire system has an adaptor connecting the frame to the vacuum pump tubing.

02

EPOXY RESIN

Epoxym Kit Component

Create monolithic & mobust mold using our carefully selected epoxy resin. It has high replication fidelity (0.2 μm) and high temperature resistance  (180°C).

EPOXYM KIT

COMPONENTS

FRAME

LATCHES

EPOXY RESIN

EPOXYM KIT

COMPONENTS

FRAMES

LATCHES

RESIN

SU-8 & Silicon Wafer

Pattern is created using SU-8 and standard photolithography techniques.

PDMS Intermediate

PDMS is cast on the silicon SU-8 mastermold & baked.

Final Epoxy Resin Mold

Epoxym resin is poured on PDMS mold. Final Epoxym replica mold baked & ready.

Epoxym Kit 2-Step Protocol

SU - 8 & SILICON WAFER

Pattern is created using SU-8 and standard photolithography techniques.

PDMS Intermediate

PDMS is cast on the silicon SU-8 mastermold & baked.

FINAL EPOXY RESIN MOLD

Epoxym resin is poured on PDMS mold. Final Epoxym replica mold baked & ready.

EPOXYM mold - Eden Tech

Advantages of Epoxym Resin Mold

EPOXYM mold - Eden Tech

Advantages of Epoxym Resin Mold

Epoxym Kit Latch Mechanism

Epoxym Kit Casting

epoxym kit principle of mold replication | Eden Tech

Epoxym Kit Latch Mechanism

Epoxym Kit Casting

epoxym kit principle of mold replication | Eden Tech

Eden Tech Youtube Channel

Videos & tips demonstrating how easy it is to to use all our products! Find step-by-step explanations on a variety of topics including:

Flexdym Bonding
Flexdym Molding
Flexdym 3D Printing
Sublym for Thermoplastics 
Sublym Program Setup
Epoxym kit steps
and more…

Eden Tech Youtube Channel

Videos & tips demonstrating how easy it is to to use all our products! Find step-by-step explanations on a variety of topics including:

Flexdym Bonding
Flexdym Molding
Flexdym 3D Printing
Sublym for Thermoplastics 
Sublym Program Setup
Epoxym kit steps
and more…

Brochures & Documents

Flexdym is our original and patented material, developed by our CEO Emmanuel Roy. Unlike other materials used in microfluidics device fabrication, Flexdym is the first material created specifically for microfluidics biomedical applications. Our Sublym hot embossing machine was then created to render device replication fast and easy. It is compact, user-friendly and affordable. Finally, our Epoxym kit produces robust mold replicas from silicon wafer molds. For more information on any of these products, check out our brochures below.

Flexdym is our original and patented material, developed by our CEO Emmanuel Roy. Unlike other materials used in microfluidics device fabrication, Flexdym is the first material created specifically for microfluidics biomedical applications. Our Sublym hot embossing machine was then created to render device replication fast and easy. It is compact, user-friendly and affordable. Finally, our Epoxym kit produces robust mold replicas from silicon wafer molds. For more information on any of these products, check out our brochures below.

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EDEN TECH

Headquarters:
11 Rue de Lourmel 
Paris 75015, France

Client Facing Office:
4 Rue de Rambervillers, 
Paris 75012, France

 The Licensee shall also mark all Products with labels containing the following language: Thermoplastic materials, Flexdym, Flexaspin, Fluoroflex, are sold under license to US patents 9,238,346 and 10,369,566 and CA patent 2,681,897 from the National Research Council Canada. Rights to use these products are limited to research uses only and are not to be used for any other purpose, such as but not limited to, commercial uses, in vitro diagnostic uses, ex vivo or in vivo therapeutic uses or any type of unauthorized applications. No other rights are conveyed. Inquiry into the availability of a license to broader rights or the use of these thermoplastic materials for commercial purposes should be directed to National Research Council Canada. Purchase of these products does not grant rights to (1) offer the products or any derivatives thereof for resale; or (2) to distribute or transfer the products or any derivative thereof to third parties. 

Trademark Flexdym  and Sublym – EU.IP Offices.

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