Sublym Hot Embossing - Alternative to Soft-lithography

The Sublym100 is a great alternative to soft-lithography microfabrication, for easy and quick production of your microfluidic devices.

The SuBlym100 is a hot embossing machine, using heat and pressure to mold a variety of materials in a matter of minutes. More specifically, it has been optimized for Flexdym polymer molding in only 2 minutes, but can also be used to mold various other thermoplastics, including PMMA.

Do you require an alternative to soft-lithography microfabrication? Because the Sublym100 hot embossing machine is a great option for easy and quick production of microfluidic chips.

The SuBlym100 is a hot embossing machine, using heat and pressure to mold a variety of materials in a matter of minutes. Consequently, it serves as a great alternative to soft-lithography casting. More specifically, the Sublym100 has been optimized for Flexdym polymer molding in only 2 minutes, but it can also be used to mold various other thermoplastics, including PMMA.

Check out below additional advantages of the Sublym100:
  • Easy-to-use, with no extensive training is needed to operate it. The Sublym is the perfect equipment for accelerating projects.
  • An ultra-compact design, that’s not much bigger than a laptop. The Sublym100 is dramatically smaller than standard commercial hot embossing machines, weighing up to 500 kg.
  • A user-friendly system, that is only powered by electricity. You can plug-and-play in the smallest of spaces.
  • Dramatically cheaper than other microfabrication equipment. The Sublym makes microfluidics more accessible to everyone.
4 Easy steps to create Flexdym chips using the Sublym:
  1. Cut a Flexdym sheet to the size of your device.
  2. Next, mold the sheet by placing the sheet, between your mold and the counter mold (included in the Sublym kit), inside the machine.
  3. Then, unmold the sheet and create inlet/outlet ports. Check out our metal punch pliers for this step.
  4. Finally, laminate sheet onto substrate. Flexdym can bond to various materials including, itself, glass, PDMS, PS, PC, COC, COP and PMMA.

A note to our Flex users: the Sublym also serves a great bonding aid for standardized Flexdym chip bonding.

This microfabrication countertop companion allows quick prototyping and production of microfluidic chips at a push of a button! What else could you need?

Want to find out more on what types of molds to use in hot embossing? Check out our Epoxym kit, solution for replicating molds.

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Dimension

33 x 34 x 11 cm3

Molding size

Up to 4" in diameter (Suitable for multiple microscope slide molding)

Max Mold Thickness

1cm (Opt:1.5cm)

Temperature

50°C – 180°C

Temperature Ramp

180°C / 5min

Approximate Force

1.2kN to 1.8kN

Power

800W

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