Customer Story

From 30 Minutes to 7.5: How the Sublym Transformed Microfluidic Device Fabrication at Emory University

Alessandra Luna, PhD candidate at Emory University & Georgia Tech, shares how the Sublym hot embossing machine replaced unreliable adhesives, delivering permanent bonds, faster prototyping, and batch production for implantable microfluidic sensors.

Alessandra Luna, PhD Candidate at Emory University
Alessandra Luna, PhD Candidate Emory University & Georgia Institute of Technology
75%
Faster fabrication time
4–5×
Devices per batch
7.5 min
Per embossing cycle

When you're developing an implantable medical device, every layer of your microfluidic assembly needs to be airtight, durable, and consistent. For Alessandra Luna, a 5th-year PhD candidate at Emory University and Georgia Institute of Technology — the stakes are especially high. Her research focuses on an implantable microfluidic intracranial pressure sensor, a device where fabrication quality directly impacts patient safety and long-term reliability. The Sublym hot embossing machine changed everything.

After struggling with inconsistent adhesive seals for months, Alessandra turned to the Sublym hot embossing machine from Eden Microfluidics. The results speak for themselves: fabrication time dropped from 30 minutes to just 7.5 minutes per cycle, with dramatically improved bond quality. Here's her full story.

Sublym hot embossing machine installed on lab bench at Emory University
The Sublym hot embossing machine on Alessandra's lab bench at Emory University, compact enough to fit alongside existing equipment.

The Challenge: Why Double-Sided Adhesive Sealing Falls Short for Microfluidic Devices

Before adopting the Sublym, Alessandra's lab relied on double-sided adhesives to seal the layers of their acrylic (PMMA) microfluidic devices. This is a common approach in academic prototyping, it requires no specialized equipment and is easy to implement. But as Alessandra quickly discovered, it comes with serious drawbacks for any application that demands long-term stability.

Alessandra Luna

Double-sided adhesives are not nearly as long-term stable as the bond produced by embossing. The adhesive seals were inconsistent and unreliable.

— Alessandra Luna, PhD Candidate, Emory University

The adhesive layers would peel off after just several days — a fatal flaw for an implantable sensor that needs to maintain hermetic seals over extended periods. Beyond durability, the manual assembly process was time-consuming and error-prone: each device required laser-cutting the adhesive (30 minutes) followed by hand assembly (3 minutes per device). For a researcher iterating rapidly through prototypes, this bottleneck was unsustainable.

The team knew they needed to shift to thermal bonding, a fabrication method that fuses polymer layers together permanently at elevated temperatures. But traditional hot embossing equipment presented its own obstacles: large footprints, high price tags, and complex operation. What Alessandra needed was something compact, affordable, and ready to use out of the box.

Why the Sublym Hot Embossing Machine?

Three criteria drove Alessandra's decision to choose the Sublym over competing solutions.

Precise Temperature Control for Acrylic Bonding

Acrylic (PMMA) bonding requires tight temperature control — too low and the layers won't fuse; too high and you risk deforming micro-scale channel geometries. The Sublym reaches the ideal temperature range for acrylic layer bonding, giving Alessandra the thermal precision she needed without complex calibration procedures.

Compact Footprint, Lab-Ready Design

Lab space in a university research setting is always at a premium. The Sublym's compact and portable design meant it could fit easily on a bench without displacing existing equipment, a critical factor when traditional hot embossing systems can occupy an entire workstation.

Affordable for Academic Budgets

Grant-funded labs can't always justify the capital expenditure of industrial equipment. The Sublym offered a cost-effective entry point into thermal bonding, making professional-grade hot embossing accessible without a five-figure investment.

From Setup to First Bonded Device: Getting Started with the Sublym Hot Embossing Machine

One of the most common barriers to adopting new lab equipment is the learning curve. Complex systems can sit unused for weeks while researchers find time to train on them. Alessandra's experience with the Sublym was the opposite.

It was very easy to get started with the Sublym. The user manual walked me through the general process very quickly. From there, it was a matter of trial and error to tune the machine's settings for the materials and geometries I was working with.

— Alessandra Luna

No specialized training sessions were required. No technician visits. The Sublym's user manual was sufficient to get Alessandra running her first bonding cycles within a short time of unboxing. The remaining optimization — dialing in temperature, pressure, and cycle duration for her specific acrylic layups — followed the intuitive trial-and-error process familiar to any experienced microfluidics researcher.

Results: Speed, Quality, and New Capabilities

75% Reduction in Fabrication Time

The productivity gains were immediate and substantial. Alessandra's old workflow — laser-cutting adhesive layers and then hand-assembling each device, consumed roughly 33 minutes per device (30 min cutting + 3 min assembly). With the Sublym, a complete molding cycle takes just 7.5 minutes. Even more impactful, the Sublym can process 4 to 5 devices simultaneously in a single batch, meaning effective per-device time drops to under 2 minutes.

⚡ Key Insight

When factoring in batch processing, the Sublym effectively delivers a 93% reduction in per-device fabrication time compared to the previous manual adhesive workflow (from ~33 min/device to ~1.5–1.9 min/device).

Sublym hot embossing machine in use at Emory University microfluidics lab
The Sublym in action, processing multiple acrylic devices in a single 7.5-minute cycle.
Close-up of Sublym hot embossing machine for microfluidic device fabrication
Compact footprint — the Sublym fits easily alongside existing lab equipment.

Dramatically Improved Bond Quality & Durability

The shift from adhesive to thermal bonding didn't just save time, it fundamentally improved the devices themselves. Where adhesive seals would fail within days, thermally bonded acrylic layers produce a permanent, hermetic seal. For an implantable intracranial pressure sensor, this improvement in long-term stability is not merely convenient, it's a prerequisite for clinical viability.

Alessandra Luna

The seal between my microfluidic layers is much more consistent and durable. Our double-sided adhesives would peel off after several days, but thermally bonding our layers together is more permanent.

— Alessandra Luna

New Capability: Vacuum-Assisted Bonding

Beyond speed and durability, the Sublym unlocked a capability Alessandra didn't have access to before, vacuum-assisted bonding. The integrated vacuum feature evacuates air from between layers during the embossing cycle, ensuring zero trapped air bubbles. For microfluidic devices where trapped air can obstruct channels or compromise sensor accuracy, this feature alone can be the difference between a working prototype and a failed one.

Streamlined Prototyping Workflow

An often-overlooked benefit of the Sublym is how it simplifies the overall prototyping pipeline. By eliminating the laser-cutting step entirely, Alessandra reduced her dependency on ancillary equipment and cut down the number of discrete process steps. The result is a leaner, faster workflow with fewer failure points.

The Sublym has greatly improved my productivity. It has given me a lot of flexibility with prototyping and has cut down my need for additional processes like laser cutting.

— Alessandra Luna

Before vs. After: Side-by-Side Comparison

Metric Before (Adhesive) After (Sublym)
Sealing method Double-sided adhesive Thermal bonding
Time per cycle ~33 min/device 7.5 min (4–5 devices)
Seal durability Days (peels off) Permanent bond
Air bubble risk High (manual placement) None (vacuum feature)
Batch processing 1 device at a time 4–5 devices per cycle
Ancillary equipment Laser cutter required Self-contained
Consistency Variable (manual) High (controlled process)

Cost, Space & Return on Investment

For academic labs evaluating hot embossing solutions, two factors tend to dominate the conversation: cost and space. Traditional hot embossing systems, while capable, often require dedicated floor space and budget allocations in the tens of thousands of dollars. The Sublym hot embossing machine occupies a fundamentally different position in the market.

From a cost perspective, I think Sublym is very affordable. Traditional hot embossing equipment can be very large and several thousands of dollars. I think the Sublym is a good investment for anyone that needs a quick and effective embossing machine that does not occupy too much space.

— Alessandra Luna

When you factor in the elimination of consumable adhesive materials, the removal of the laser-cutting step, and the time savings across hundreds of prototyping cycles, the total cost of ownership of the Sublym becomes remarkably compelling. Researchers gain access to industrial-quality thermal bonding at a fraction of the price and footprint.

The Verdict: Who Should Consider the Sublym?

Alessandra Luna

I would definitely recommend the Sublym to colleagues. Especially anybody trying to create microfluidics with plastics. It is convenient, affordable, and easy to use.

— Alessandra Luna

Based on this case study, the Sublym hot embossing machine is an ideal fit for research teams and labs that work with thermoplastic microfluidic devices (especially PMMA/acrylic), need reliable thermal bonding without the cost of industrial equipment, operate in space-constrained lab environments, or require fast turnaround for iterative prototyping.

Whether you're fabricating medical devices, organ-on-a-chip platforms, diagnostic cartridges, or microfluidic sensors, the Sublym hot embossing machine delivers professional-grade results at a price point and form factor designed for the realities of academic and startup labs.

Frequently Asked Questions About the Sublym Hot Embossing Machine

How long does a hot embossing cycle take with the Sublym?
A complete molding cycle takes approximately 7.5 minutes. Because the Sublym can process 4–5 devices simultaneously, the effective per-device time is under 2 minutes, a 75–93% improvement over manual adhesive workflows.
Can the Sublym bond acrylic (PMMA) microfluidic layers?
Yes. The Sublym reaches the ideal temperature range for acrylic layer bonding. The integrated vacuum feature ensures no air bubbles are trapped between layers, producing consistent and permanent seals suitable for medical-grade devices.
Is the Sublym suitable for small labs with limited bench space?
Absolutely. The Sublym was designed to be compact and portable, making it ideal for university research labs, cleanrooms, and startup environments where bench space is at a premium. It delivers the functionality of large industrial systems in a fraction of the footprint.
How does the Sublym compare to traditional hot embossing equipment in terms of cost?
The Sublym is significantly more affordable than traditional hot embossing systems, which typically cost several thousand dollars and require substantial floor space. It provides an accessible entry point to professional thermal bonding for grant-funded academic labs and startups.
Does the Sublym require specialized training?
No. The included user manual covers the general process, and most researchers can begin bonding devices immediately. Fine-tuning temperature and pressure settings for specific materials and geometries follows a straightforward trial-and-error process.
What types of microfluidic devices can the Sublym produce?
The Sublym is suitable for any thermoplastic microfluidic device that requires thermal bonding — including lab-on-a-chip platforms, diagnostic cartridges, organ-on-chip devices, implantable sensors, and microfluidic pressure sensors. It's particularly well-suited for acrylic (PMMA) devices.

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