POINT-OF-CARE
scale-up KIT
POINT-OF-CARE scale-up KIT
Microfluidics Made Easy At All Production Scales.
Point-of-Care Scale-Up Kit
Are you struggling with your microfluidics Point-of-Care (POC) device development and scale-up?
Eden Tech’s scale-up kit for point-of-care diagnostics is the solution you need to boost your microfluidic device fabrication, for a research project or product development. The Scale-Up Kit is designed for researchers facing challenges in their device fabrication and production related to… material properties, non-scalable material, complicated fabrication processes, or strict deadlines.
The Point-of-Care Scale-Up kit contains biocompatible polymer, Flexdym, is a thermoplastic elastomer which serves as a great alternative to PDMS, combining its most desired material properties with the efficiency of fabrication processes used for thermoplastics.
The Scale-Up Kit includes everything you need to get started with Flexdym for point-of-care device fabrication: the Sublym hot embossing machine, 4 Flexdym start packs, the Epoxym mold solution, 5 connector sets, and a port puncher. With this kit you will be able to scale-up your device production from small scale to medium scale production with our user-friendly and efficient protocols. Once you are ready to begin mass production, know that the Flexdym is compatible with both roll-to-roll embossing and injection molding methods.
Unlike most other materials commonly used in microfluidics, Flexdym is the first material specifically formulated and developed for microfluidic diagnostic applications. Originally developed by our CEO, Emmanuel Roy, Flexdym was created for a point-of-care diagnostics and incorporates key material properties for these applications including softness, elasticity, optical transparency, instant assembly, treatment-free bonding, and compatibility with manufacturing processes at all scales of production. Flexdym takes you from initial prototyping to commercialization.
To find out more and watch protocol videos, check out our youtube.
You can also follow us on Linkedin for regular updates or contact us directly!
| Optional | Epoxym Incl., Epoxym Not Incl. |
|---|---|
| Connector Type | Luer, Olive |
| Puncher Die cut | 0.5 mm, 1 mm, 1.5 mm, 2 mm, 2.5 mm, 3 mm, 3.5 mm, 4 mm, 5 mm |
| Heat Resistant Gloves Size | Small, Medium, Large |
The microfluidic Point-of-Care Scale-Up Kit is a complete solution for innovators struggling with their cartridge design & development. It requires a small investment and provides all of the components needed for mold replication, device replication, device assembly, device bonding & chip-to-world experimental setup. The Point-of-Care Scale-Up Kit includes: The Flexdym biocompatible and scalable polymer, the Sublym portable hot embossing machine, the Epoxym mold replication solution and inlet/outlet accessories. Request Product Kit Brochure
Flexdym Material Properties
FOR POC DIAGNOSTICS
Flexdym is the first material formulated for microfluidics biomedical applications, but it was originally formulated by our CEO for the fabrication of point-of-care microfluidic cartridges. The Flexdym possesses various material properties which make it advantageous for diagnostic applications.
Certified Biocomptability
Flexdym is certified biocompatible according to international standards USP & ISO. It is certified ISO 10993 parts 4, 5, 6, 10 & 11,
Soft & Elastomeric
Flexdym is a thermoplastic elastomer with a Young Modulus of 1.15 MPa, resembling the softness of PDMS. However, Flexdym is a block co-polymer which unites the best of elastomers and PDMS.
Optical Transparency
Flexdym has a refractive index of 1.6. It exhibits high transmittance on UV visible region (>50 % from 295 nm until 800 nm)
Adhesive
Flexdym has a block co-polymer chemistry, composed of hard styrenic blocks and a soft ethylene-butylene matrix.
Low Absorption
Flexdym displays lower absorption of small hydrophobic molecules, such as nucleic acids or proteins, used in nucleic acid amplification or lateral flow assays. To read experimental results, contact us for a copy of our Lab on Chip article.
Recycleable Material
Flexdym is a thermoplastic which means it can be re-molded and re-used. It can also be sterilized using gamma rays, autoclave or UV disinfection. This means you can do more with the same amount.
Resistance to high temperatures
Flexdym can withstand classic thermocycling temperatures of up to 95°C required for processes such as enzyme activation. This temperature has been tested and can be sustained for up to 60 minutes without leakage or damage to device features.
No Additives
Unlike other SEBS materials, Flexdym is free of toxic additives, such as tackifiers, plasticizers, or UV protectors. This contributes to the material biocompatibility and stability.
Flexdym Material Properties
FOR POC DIAGNOSTICS
Flexdym is the first material formulated for microfluidics biomedical applications, but it was originally formulated by our CEO for the fabrication of point-of-care microfluidic cartridges. The Flexdym possesses various material properties which make it advantageous for diagnostic applications.
Certified Biocomptability
Flexdym is certified biocompatible according to international standards USP & ISO. It is certified ISO 10993 parts 4, 5, 6, 10 & 11,
Soft & Elastomeric
Flexdym is a thermoplastic elastomer with a Young Modulus of 1.15 MPa, resembling the softness of PDMS. However, Flexdym is a block co-polymer which unites the best of elastomers and PDMS.
Optical Transparency
Flexdym has a refractive index of 1.6. It exhibits high transmittance on UV visible region (>50 % from 295 nm until 800 nm)
Adhesive
Flexdym has a block co-polymer chemistry, composed of hard styrenic blocks and a soft ethylene-butylene matrix.
Low Absorption
Flexdym displays lower absorption of small hydrophobic molecules, such as nucleic acids or proteins, used in nucleic acid amplification or lateral flow assays. To read experimental results, contact us for a copy of our Lab on Chip article.
Recycleable Material
Flexdym is a thermoplastic which means it can be re-molded and re-used. It can also be sterilized using gamma rays, autoclave or UV disinfection. This means you can do more with the same amount.
Resistance to high temperatures
Flexdym can withstand classic thermocycling temperatures of up to 95°C required for processes such as enzyme activation. This temperature has been tested and can be sustained for up to 60 minutes without leakage or damage to device features.
No Additives
Unlike other SEBS materials, Flexdym is free of toxic additives, such as tackifiers, plasticizers, or UV protectors. This contributes to the material biocompatibility and stability.
Point-of-care kit
BONDING TO DIFFERENT MATERIALS
Flexdym has the unique ability to bond to various other materials, including polystyrene, polycarbonate, PMMA, COC, glass and silicon. This provides the user with a range of options for the fabrication of hybrid devices and cartridge component integration. Bonding strength is determined by the substrate material, providing a range between reversible and permanent bonding. Therefore, Flexdym also works as an ideal cartridge seal.
BONDING TO DIFFERENT MATERIALS
Flexdym has the unique ability to bond to various other materials, including polystyrene, polycarbonate, PMMA, COC, glass and silicon. This provides the user with a range of options for the fabrication of hybrid devices and cartridge component integration. Bonding strength is determined by the substrate material, providing a range between reversible and permanent bonding. Therefore, Flexdym also works as an ideal cartridge seal.
BONDING AT DIFFERENT
TEMPERATURES
The Flexdym bonding mechanism is based on good conformal contact, meaning there are no harsh chemical or temperature treatments required for device assembly or bonding. This is a major advantage for innovators when trying to lower costs of point-of-care devices and cartridges.Â
BONDING AT DIFFERENT
TEMPERATURES
The Flexdym bonding mechanism is based on good conformal contact, meaning there are no harsh chemical or temperature treatments required for device assembly or bonding. This is a major advantage for innovators when trying to lower costs of point-of-care devices and cartridges.Â
Flexdym Point-of-Care Device Fabrication
The Point-of-care Scale-Up Kit makes device fabrication, from initial prototyping stages to medium production scales, easy…
3 Minute Replication
Our Sublym hot embossing machine can mold Flexdym in as little as 1 minute!
3 Minute Assembly
Using Sublym, assembling Flexdym devices is treatment free, easy & standardized.
1 Hour Bonding
Bonding of Flexdym devices takes as little as 1 hour, with the need for harsh treatments.
Flexdym Point-of-Care Device Fabrication
The Point-of-care Scale-Up Kit makes device fabrication, from initial prototyping stages to medium production scales, easy…
3Minute Replication
Our Sublym hot embossing machine can mold Flexdym in as little as 1 minute!
3 Minute Assembly
Using Sublym, assembling Flexdym devices is treatment free, easy & standardized.
1 Hour Bonding
Bonding of Flexdym devices takes as little as 1 hour, with the need for harsh treatments.
Microfluidic Device Production
Flexdym Processing & Production Methods
Flexdym is the first material with compatible with every scale of cartridge production. Unlike other materials, which have been repurposed from MEMs to microfluidics, Flexdym is specifically created for a point-of-care diagnostic application. It’s formulation has been created to incorporate the most advantageous material properties and fabrication options, to make microfluidic device fabrication user-friendly. Request Brochure
Hot Embossing
Hot embossing is an excellent alternative to PDMS soft lithgraphy, as it allows for high replication fidelity down to the nanometric scale. Flexdym is compatible with hot embossing, which can be used from small to medium scale microfluidic device production.Â
Injection Molding
Flexdym is also compatible with injection molding, a standard mass production technology for microfluidic device production. In injection molding, the material is melted and ejected into a mold cavity. The replication cycle time can be as short as a few seconds, making it the reference processing method for industry.
Roll-to-Roll Embossing
Flexdym is compatible with roll-to-roll embossing, another medium to large scale production method for point-of-care cartridges. There are fewer materials compatible with this method, in which the polymer film is rolled through molds wheels containing the patterned device design.
Microfluidic Device Production
Flexdym Processing & Production Methods
Flexdym is the first material with compatible with every scale of cartridge production. Unlike other materials, which have been repurposed from MEMs to microfluidics, Flexdym is specifically created for a point-of-care diagnostic application. It’s formulation has been created to incorporate the most advantageous material properties and fabrication options, to make microfluidic device fabrication user-friendly. Request Brochure
Hot Embossing
Hot embossing is an excellent alternative to PDMS soft lithgraphy, as it allows for high replication fidelity down to the nanometric scale. Flexdym is compatible with hot embossing, which can be used from small to medium scale microfluidic device production.Â
Injection Molding
Flexdym is also compatible with injection molding, a standard mass production technology for microfluidic device production. In injection molding, the material is melted and ejected into a mold cavity. The replication cycle time can be as short as a few seconds, making it the reference processing method for industry.
Roll-to-Roll Embossing
Flexdym is compatible with roll-to-roll embossing, another medium to large scale production method for point-of-care cartridges. There are fewer materials compatible with this method, in which the polymer film is rolled through molds wheels containing the patterned device design.
Device Replication & assembly
SUBLYM
HOT EMBOSSING MACHINE
The Sublym hot embossing machine is the first portable plug-&-play hot embossing machine on the market. It is also dramatically cheaper than classic hot embossing machines priced in the range of hundreds of thousands of dollars.Â
Portable Plug-&-Play
The Sublym is the first portable hot embossing machine that fits any benchtop laboratory space. It is compact, light and easy to transport.
User-Friendly Design
The Sublym has a user-friendly design that does not require special training. The screen allows adjustment of time and temperature parameters.Â
Exchangeable Membrane
The hot embossing mechanism is based on applied heat and pressure, to replicate the device design. A deformable membrane applies pressur eunder vaccum.Â
Adjustable Spacers
The Sublym is the first portable hot embossing machine that fits any benchtop laboratory space. It is compact, light and easy to transport.
Device Replication & assembly
the SUBLYM
HOT EMBOSSING
MACHINE
The Sublym hot embossing machine is the first portable plug-&-play hot embossing machine on the market. It is also dramatically cheaper than classic hot embossing machines priced in the range of hundreds of thousands of dollars.Â
Portable Plug-&-Play
The Sublym is the first portable hot embossing machine that fits any benchtop laboratory space. It is compact, light and easy to transport.
User-Friendly Design
The Sublym has a user-friendly design that does not require special training. The screen allows adjustment of time and temperature parameters.Â
Exchangeable Membrane
The hot embossing mechanism is based on applied heat and pressure, to replicate the device design. A deformable membrane applies pressur eunder vaccum.Â
Adjustable Spacers
The Sublym is the first portable hot embossing machine that fits any benchtop laboratory space. It is compact, light and easy to transport.
Mold replication
EPOXYM MOLD SOLUTION
The Epoxym mold replication solution provides innovators at the initial stages of device development, with low-cost molds for routine device replication.
Glass Molds
The Sublym is compatible with etched glass molds, or even combined SU-8 & glass molds - our recommendation for affordable initial prototyping.Â
Silicon Molds
Classic SU-8 & silicon wafer combined molds, familiar to users of PDMS & soft-lithography fabrication. However, these are fragile & less cost-effective.
Resin Molds
Epoxy resin molds are another great alternative for affordable molds. Our Epoxym kit allows replication of silicon wafer molds into robust resin molds.
Metal Molds
Metallic molds are usually used in mass production processes such as injection molding. But they can also be used in the Sublym system.
Mold replication
EPOXYM MOLD SOLUTION
The Epoxym mold replication solution provides innovators at initital stages of device development, with low cost mols for routine device replication.
Glass Molds
The Sublym is compatible with etched glass molds, or even combined SU-8 & glass molds - our recommendation for affordable initial prototyping.Â
Silicon Molds
Classic SU-8 & silicon wafer combined molds, familiar to users of PDMS & soft-lithography fabrication. However, these are fragile & less cost-effective.
Resin Molds
Epoxy resin molds are another great alternative for affordable molds. Our Epoxym kit allows replication of silicon wafer molds into robust resin molds.
Metal Molds
Metallic molds are usually used in mass production processes such as injection molding. But they can also be used in the Sublym system.
FLEXDYM DEVICE
CONNECTORS
The Point-of-Care Scale-Up Kit includes connection adaptors for chip-to-world connection. The default option is Luer adaptors, but there is also the possibility to switch to more compact olive connectors.
FLEXDYM DEVICE
CONNECTORS
The Point-of-Care Scale-Up Kit includes connection adaptors for chip-to-world connection. The default option are luer adaptors, but there is also the possibility to switch to more compact olive connectors.
FLEXDYM DEVICE
PUNCHER
The Point-of-Care Scale-Up kit also includes a puncher for the creation of inlet and outlets ports for your microfluidic device.
PUNCHER
The Point-of-Care Scale-Up kit also includes a puncher for the creation of inlet and outlets ports for your microfluidic device.
HOW POC KIT SHIPPING WORKS
Order
The product is available to pre-order at four week time increments.
Production
After this time, the orders will start to be produced during a two week period, and new orders will be added to the same shipment while stock is available.
Shipment
At this stage, items are shipped, usually taking a few working days to arrive, depending on client location.
EDEN TECH
Untap the Power
About Us
Eden Tech is a company reinventing microfluidics with user-friendly and scalable solutions. Our products are aimed at pushing forward both academic and industrial innovation.
Contact Us
Information
Useful Links
Trademark Flexdym and Sublym - EU.IP Offices.
EDEN TECH
Untap the Power
About Us
Eden Tech is a company reinventing microfluidics with user-friendly and scalable solutions. Our products are aimed at pushing forward both academic and industrial innovation.