POINT-OF-CARE
scale-up KIT

POINT-OF-CARE scale-up KIT

Microfluidics Made Easy At All Production Scales.

Are you struggling with your microfluidics Point-of-Care (POC) device development and scale-up?

Eden Tech’s scale-up kit for point-of-care diagnostics is the solution you need to boost your microfluidic device fabrication, for a research project or product development. The Scale-Up Kit is designed for researchers facing challenges in their device fabrication and production related to… material properties, non-scalable material, complicated fabrication processes, or strict deadlines.

SKU: M-POC0001 Category:

The Point-of-Care Scale-Up kit contains biocompatible polymer, Flexdym, is a thermoplastic elastomer which serves as a great alternative to PDMS, combining its most desired material properties with the efficiency of fabrication processes used for thermoplastics.

The Scale-Up Kit includes everything you need to get started with Flexdym for point-of-care device fabrication: the Sublym hot embossing machine, 4 Flexdym start packs, the Epoxym mold solution, 5 connector sets, and a port puncher. With this kit you will be able to scale-up your device production from small scale to medium scale production with our user-friendly and efficient protocols. Once you are ready to begin mass production, know that the Flexdym is compatible with both roll-to-roll embossing and injection molding methods.

Unlike most other materials commonly used in microfluidics, Flexdym is the first material specifically formulated and developed for microfluidic diagnostic applications. Originally developed by our CEO, Emmanuel Roy, Flexdym was created for a point-of-care diagnostics and incorporates key material properties for these applications including softness, elasticity, optical transparency, instant assembly, treatment-free bonding, and compatibility with manufacturing processes at all scales of production. Flexdym takes you from initial prototyping to commercialization.

To find out more and watch protocol videos, check out our youtube.
You can also follow us on Linkedin for regular updates or contact us directly!

 

Optional

Epoxym Incl., Epoxym Not Incl.

Connector Type

Luer, Olive

Puncher Die cut

0.5 mm, 1 mm, 1.5 mm, 2 mm, 2.5 mm, 3 mm, 3.5 mm, 4 mm, 5 mm

Heat Resistant Gloves Size

Small, Medium, Large

The microfluidic Point-of-Care Scale-Up Kit is a complete solution for innovators struggling with their cartridge design & development. It requires a small investment and provides all of the components needed for mold replication, device replication, device assembly, device bonding & chip-to-world experimental setup. The Point-of-Care Scale-Up Kit includes: The Flexdym biocompatible and scalable polymer, the Sublym portable hot embossing machine, the Epoxym mold replication solution and inlet/outlet accessories.  Request Product Kit Brochure

Flexdym Material Properties

FOR POC DIAGNOSTICS

Flexdym is the first material formulated for microfluidics biomedical applications, but it was originally formulated by our CEO for the fabrication of point-of-care microfluidic cartridges. The Flexdym possesses various material properties which make it advantageous for diagnostic applications.

Certified Biocomptability

Flexdym is certified biocompatible according to international standards USP & ISO. It is certified ISO 10993 parts 4, 5, 6, 10 & 11,

Soft & Elastomeric

Flexdym is a thermoplastic elastomer with a Young Modulus of 1.15 MPa, resembling the softness of PDMS. However, Flexdym is a block co-polymer which unites the best of elastomers and PDMS.

Optical Transparency

Flexdym has a refractive index of 1.6. It exhibits high transmittance on UV visible region (>50 % from 295 nm until 800 nm)

Adhesive

Flexdym has a block co-polymer chemistry, composed of hard styrenic blocks and a soft ethylene-butylene matrix.

Low Absorption

Flexdym displays lower absorption of small hydrophobic molecules, such as nucleic acids or proteins, used in nucleic acid amplification or lateral flow assays. To read experimental results, contact us for a copy of our Lab on Chip article.

Recycleable Material

Flexdym is a thermoplastic which means it can be re-molded and re-used. It can also be sterilized using gamma rays, autoclave or UV disinfection. This means you can do more with the same amount.

Resistance to high temperatures

Flexdym can withstand classic thermocycling temperatures of up to 95°C required for processes such as enzyme activation. This temperature has been tested and can be sustained for up to 60 minutes without leakage or damage to device features.

No Additives

Unlike other SEBS materials, Flexdym is free of toxic additives, such as tackifiers, plasticizers, or UV protectors. This contributes to the material biocompatibility and stability.

Flexdym Material Properties

FOR POC DIAGNOSTICS

Flexdym is the first material formulated for microfluidics biomedical applications, but it was originally formulated by our CEO for the fabrication of point-of-care microfluidic cartridges. The Flexdym possesses various material properties which make it advantageous for diagnostic applications.

Certified Biocomptability

Flexdym is certified biocompatible according to international standards USP & ISO. It is certified ISO 10993 parts 4, 5, 6, 10 & 11,

Soft & Elastomeric

Flexdym is a thermoplastic elastomer with a Young Modulus of 1.15 MPa, resembling the softness of PDMS. However, Flexdym is a block co-polymer which unites the best of elastomers and PDMS.

Optical Transparency

Flexdym has a refractive index of 1.6. It exhibits high transmittance on UV visible region (>50 % from 295 nm until 800 nm)

Adhesive

Flexdym has a block co-polymer chemistry, composed of hard styrenic blocks and a soft ethylene-butylene matrix.

Low Absorption

Flexdym displays lower absorption of small hydrophobic molecules, such as nucleic acids or proteins, used in nucleic acid amplification or lateral flow assays. To read experimental results, contact us for a copy of our Lab on Chip article.

Recycleable Material

Flexdym is a thermoplastic which means it can be re-molded and re-used. It can also be sterilized using gamma rays, autoclave or UV disinfection. This means you can do more with the same amount.

Resistance to high temperatures

Flexdym can withstand classic thermocycling temperatures of up to 95°C required for processes such as enzyme activation. This temperature has been tested and can be sustained for up to 60 minutes without leakage or damage to device features.

No Additives

Unlike other SEBS materials, Flexdym is free of toxic additives, such as tackifiers, plasticizers, or UV protectors. This contributes to the material biocompatibility and stability.

Point-of-care kit

BONDING MECHANISM OF FLEXDYM

Discover how Flexdym accomplishes treatment-free bonding to various materials

BONDING MECHANISM OF FLEXDYM

Discover how Flexdym accomplishes treatment-free bonding to various materials.

BONDING TO DIFFERENT MATERIALS

Flexdym has the unique ability to bond to various other materials, including polystyrene, polycarbonate, PMMA, COC, glass and silicon.  This provides the user with a range of options for the fabrication of hybrid devices and cartridge component integration. Bonding strength is determined by the substrate material, providing a range between reversible and permanent bonding. Therefore, Flexdym also works as an ideal cartridge seal.

BONDING TO DIFFERENT MATERIALS

Flexdym has the unique ability to bond to various other materials, including polystyrene, polycarbonate, PMMA, COC, glass and silicon.  This provides the user with a range of options for the fabrication of hybrid devices and cartridge component integration. Bonding strength is determined by the substrate material, providing a range between reversible and permanent bonding. Therefore, Flexdym also works as an ideal cartridge seal.

BONDING AT DIFFERENT
TEMPERATURES

The Flexdym bonding mechanism is based on good conformal contact, meaning there are no harsh chemical or temperature treatments required for device assembly or bonding. This is a major advantage for innovators when trying to lower costs of point-of-care devices and cartridges. 

BONDING AT DIFFERENT
TEMPERATURES

The Flexdym bonding mechanism is based on good conformal contact, meaning there are no harsh chemical or temperature treatments required for device assembly or bonding. This is a major advantage for innovators when trying to lower costs of point-of-care devices and cartridges. 

Flexdym Point-of-Care Device Fabrication

The Point-of-care Scale-Up Kit makes device fabrication, from initial prototyping stages to medium production scales, easy…

3 Minute Replication

Our Sublym hot embossing machine can mold Flexdym in as little as 1 minute!

Watch Protocol Video

3 Minute Assembly

Using Sublym, assembling Flexdym devices is treatment free, easy & standardized.

Watch Protocol Video

1 Hour Bonding

Bonding of Flexdym devices takes as little as 1 hour, with the need for harsh treatments.

Watch Protocol Video

Flexdym Point-of-Care Device Fabrication

The Point-of-care Scale-Up Kit makes device fabrication, from initial prototyping stages to medium production scales, easy…

3Minute Replication

Our Sublym hot embossing machine can mold Flexdym in as little as 1 minute!

3 Minute Assembly

Using Sublym, assembling Flexdym devices is treatment free, easy & standardized.

1 Hour Bonding

Bonding of Flexdym devices takes as little as 1 hour, with the need for harsh treatments.

Microfluidic Device Production

Flexdym Processing & Production Methods

Flexdym is the first material with compatible with every scale of cartridge production.  Unlike other materials, which have been repurposed from MEMs to microfluidics, Flexdym is specifically created for a point-of-care diagnostic application. It’s formulation has been created to incorporate the most advantageous material properties and fabrication options, to make microfluidic device fabrication user-friendly.  Request Brochure

Hot Embossing

Hot embossing is an excellent alternative to PDMS soft lithgraphy, as it allows for high replication fidelity down to the nanometric scale. Flexdym is compatible with hot embossing, which can be used from small to medium scale microfluidic device production. 

Injection Molding

Flexdym is also compatible with injection molding, a standard mass production technology for microfluidic device production. In injection molding, the material is melted and ejected into a mold cavity. The replication cycle time can be as short as a few seconds, making it the reference processing method for industry.

Roll-to-Roll Embossing

Flexdym is compatible with roll-to-roll embossing, another medium to large scale production method for point-of-care cartridges. There are fewer materials compatible with this method, in which the polymer film is rolled through molds wheels containing the patterned device design.

Microfluidic Device Production

Flexdym Processing & Production Methods

Flexdym is the first material with compatible with every scale of cartridge production.  Unlike other materials, which have been repurposed from MEMs to microfluidics, Flexdym is specifically created for a point-of-care diagnostic application. It’s formulation has been created to incorporate the most advantageous material properties and fabrication options, to make microfluidic device fabrication user-friendly.  Request Brochure

Hot Embossing

Hot embossing is an excellent alternative to PDMS soft lithgraphy, as it allows for high replication fidelity down to the nanometric scale. Flexdym is compatible with hot embossing, which can be used from small to medium scale microfluidic device production. 

Injection Molding

Flexdym is also compatible with injection molding, a standard mass production technology for microfluidic device production. In injection molding, the material is melted and ejected into a mold cavity. The replication cycle time can be as short as a few seconds, making it the reference processing method for industry.

Roll-to-Roll Embossing

Flexdym is compatible with roll-to-roll embossing, another medium to large scale production method for point-of-care cartridges. There are fewer materials compatible with this method, in which the polymer film is rolled through molds wheels containing the patterned device design.

Device Replication & assembly

SUBLYM
HOT EMBOSSING MACHINE

The Sublym hot embossing machine is the first portable plug-&-play hot embossing machine on the market. It is also dramatically cheaper than classic hot embossing machines priced in the range of hundreds of thousands of dollars. 

Portable Plug-&-Play

The Sublym is the first portable hot embossing machine that fits any benchtop laboratory space. It is compact, light and easy to transport.

User-Friendly Design

The Sublym has a user-friendly design that does not require special training. The screen allows adjustment of time and temperature parameters. 

Exchangeable Membrane

The hot embossing mechanism is based on applied heat and pressure, to replicate the device design. A deformable membrane applies pressur eunder vaccum. 

Adjustable Spacers

The Sublym is the first portable hot embossing machine that fits any benchtop laboratory space. It is compact, light and easy to transport.

Device Replication & assembly

the SUBLYM
HOT EMBOSSING
MACHINE

The Sublym hot embossing machine is the first portable plug-&-play hot embossing machine on the market. It is also dramatically cheaper than classic hot embossing machines priced in the range of hundreds of thousands of dollars. 

Portable Plug-&-Play

The Sublym is the first portable hot embossing machine that fits any benchtop laboratory space. It is compact, light and easy to transport.

User-Friendly Design

The Sublym has a user-friendly design that does not require special training. The screen allows adjustment of time and temperature parameters. 

Exchangeable Membrane

The hot embossing mechanism is based on applied heat and pressure, to replicate the device design. A deformable membrane applies pressur eunder vaccum. 

Adjustable Spacers

The Sublym is the first portable hot embossing machine that fits any benchtop laboratory space. It is compact, light and easy to transport.

Mold replication

EPOXYM MOLD SOLUTION

The Epoxym mold replication solution provides innovators at the initial stages of device development, with low-cost molds for routine device replication.

Glass Molds

The Sublym is compatible with etched glass molds, or even  combined SU-8 & glass molds - our recommendation for affordable initial prototyping. 

Silicon Molds

Classic SU-8 & silicon wafer combined molds, familiar to users of PDMS & soft-lithography fabrication. However, these are fragile & less cost-effective.

Resin Molds

Epoxy resin molds are another great alternative for affordable molds. Our Epoxym kit allows replication of silicon wafer molds into robust resin molds.

Metal Molds

Metallic molds are usually used in mass production processes such as injection molding. But they can also be used in the Sublym system.

Mold replication

EPOXYM MOLD SOLUTION

The Epoxym mold replication solution provides innovators at initital stages of device development, with low cost mols for routine device replication.

microfluidic point of care scale up kit eden tech

Glass Molds

The Sublym is compatible with etched glass molds, or even  combined SU-8 & glass molds - our recommendation for affordable initial prototyping. 

Silicon Molds

Classic SU-8 & silicon wafer combined molds, familiar to users of PDMS & soft-lithography fabrication. However, these are fragile & less cost-effective.

Resin Molds

Epoxy resin molds are another great alternative for affordable molds. Our Epoxym kit allows replication of silicon wafer molds into robust resin molds.

Metal Molds

Metallic molds are usually used in mass production processes such as injection molding. But they can also be used in the Sublym system.

chip-to-world connection

ACCESSORIES

CHIP-TO-WORLD CONNECTION
ACCESSORIES

FLEXDYM DEVICE

CONNECTORS

The Point-of-Care Scale-Up Kit includes connection adaptors for chip-to-world connection. The default option is Luer adaptors, but there is also the possibility to switch to more compact olive connectors.

FLEXDYM DEVICE

CONNECTORS

The Point-of-Care Scale-Up Kit includes connection adaptors for chip-to-world connection. The default option are luer adaptors, but there is also the possibility to switch to more compact olive connectors.

FLEXDYM DEVICE

PUNCHER

The Point-of-Care Scale-Up kit also includes a puncher for the creation of inlet and outlets ports for your microfluidic device.

Eden Tech - Microfluidics - POC kit - Puncher - 2

PUNCHER

The Point-of-Care Scale-Up kit also includes a puncher for the creation of inlet and outlets ports for your microfluidic device.

HOW POC KIT SHIPPING WORKS

Order

The product is available to pre-order at four week time increments.

Production

After this time, the orders will start to be produced during a two week period, and new orders will be added to the same shipment while stock is available.

Shipment

At this stage, items are shipped, usually taking a few working days to arrive, depending on client location.

HOW TO FABRICATE A

POINT-OF-CARE CHIP?

Connector n chip - low
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Eden Tech

Twitter: @EdenTechParis
Linkedin: Eden Tech Microfluidics
Youtube: Eden Tech Microfluidics
 

 The Licensee shall also mark all Products with labels containing the following language: Thermoplastic materials, Flexdym, Flexaspin, Fluoroflex, are sold under license to US patents 9,238,346 and 10,369,566 and CA patent 2,681,897 from the National Research Council Canada. Rights to use these products are limited to research uses only and are not to be used for any other purpose, such as but not limited to, commercial uses, in vitro diagnostic uses, ex vivo or in vivo therapeutic uses or any type of unauthorized applications. No other rights are conveyed. Inquiry into the availability of a license to broader rights or the use of these thermoplastic materials for commercial purposes should be directed to National Research Council Canada. Purchase of these products does not grant rights to (1) offer the products or any derivatives thereof for resale; or (2) to distribute or transfer the products or any derivative thereof to third parties.

 

Trademark Flexdym  and Sublym – EU.IP Offices.

Logo Large | Eden Tech

Eden Tech

Twitter: @EdenTechParis
Linkedin: Eden Tech Microfluidics
Youtube: Eden Tech Microfluidics
 

 The Licensee shall also mark all Products with labels containing the following language: Thermoplastic materials, Flexdym, Flexaspin, Fluoroflex, are sold under license to US patents 9,238,346 and 10,369,566 and CA patent 2,681,897 from the National Research Council Canada. Rights to use these products are limited to research uses only and are not to be used for any other purpose, such as but not limited to, commercial uses, in vitro diagnostic uses, ex vivo or in vivo therapeutic uses or any type of unauthorized applications. No other rights are conveyed. Inquiry into the availability of a license to broader rights or the use of these thermoplastic materials for commercial purposes should be directed to National Research Council Canada. Purchase of these products does not grant rights to (1) offer the products or any derivatives thereof for resale; or (2) to distribute or transfer the products or any derivative thereof to third parties.

 

Trademark Flexdym  and Sublym – EU.IP Offices.

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