FLEXDYM™

Biocompatible | Non-leaching | Scalable from Lab to Production

The Alternative to PDMS

Flexdym™ is a thermoplastic elastomer engineered for microfluidics that solves the critical limitations of PDMS, allowing you to prototype quickly, bond easily, and scale without compromise.

From Micro to Nano-Sized Structures

DEVICE REPLICATION

Flexdym™ microfluidic chips are molded and replicated via hot embossing, which allows the replication of structures at higher levels of accuracy and precision than soft lithography.

Problems: The Limitations of PDMS in Microfluidics

Solution: Flexdym™

Microfluidic Expert Interview

Flexdym™ Features

Flexdym™ embodies specific core values critical for advanced microfluidics: its inherent Biocompatibility, exceptional Versatility in Fabrication, and remarkable Scalability. These intrinsic properties are fundamental to its innovative application.

Flexdym™ is a styrene-based thermoplastic elastomer (SEBS) designed for simple, effective bonding in microfluidic device fabrication without the need for heat, solvents, plasma treatment, or expensive equipment.
 

Key Features

  • Room Temperature Bonding (RTB): Enables fast, equipment-free assembly.
  • No Deformation or Warping: Maintains microchannel integrity during bonding.
  • Reversible & Irreversible Bonding throught different methods, up to 4 bar.
  • Substrate Compatibility: Bonds to Flexdym™, Glass, COC, PMMA, PS, even when untreated.
  • Cost-Effective & Scalable: Reduces fabrication cost and is suitable for prototyping and mass production.

Ideal for

  • Microfluidic prototyping
  • Diagnostic and lab-on-chip devices
  • Injection-molded components
  • Biological and tissue engineering applications

We have conducted gas permeability tests for 2 mm of Flexdym at 23°C, 50% RH. Subsequently, these results, combined with those of other Flexdym™ users, show a range of 40 to 70-fold lower gas permeability for Flexdym™ compared to PDMS. Nevertheless, cell culture remains a top application of Flexdym™. For instance, for published results, contact us.

Much like PDMS and other thermoplastic materials used in microfluidic device fabrication, Flexdym™ is resistant to commonly used solvents such as acids and bases, as well as methanol/ethanol. Furthermore, it is resistant to fluorinated oils, commonly used in droplet-based microfluidic applications. However, like these other materials, results show it swells in the presence of carboxylic acid and other oils. Indeed, it may be important to note, it is not resistant to hydrocarbons. To that end, to find out more about Flexdym™ material chemistry, read our news article.

Flexdym™ combines properties of thermoplastics and elastomers. This explains it’s elasticity (Young Modulus of 1.15 MPa) and simultaneous ability to be hot embossed. 

Flexdym alternative to PDMS Microfluidic Mold Service

Flexdym SHEETS Starter Pack

The starter pack is the perfect format for first-time Flexdym™ users to test the material for their application. Moreover, within one starter pack, different thicknesses can be mixed, making the selection process easier for you. 

Flexdym alternative to PDMS Microfluidic Mold Service

Flexdym Rolls

Following initial testing, the Flexdym Rolls offer a more cost-effective format for users. Furthermore, they are compatible with roll-to-roll embossing methods for mass production. 

Flexdym alternative to PDMS Microfluidic Mold Service

Flexdym Pellets

For experienced users, the Flexdym™ Pellets are ideal for those who have developed a marketable product using this technology. Subsequently, they are suitable for beginning mass production or 3D printing with our Flexdym pellets.

Easy Steps for Flexdym™ Microfluidic Chips

01

Cut it

Cut the protected Flexdym™ sheet to the required dimensions: the material is ready to be molded.

02

Press it

Remove the protective film from one side of the sheet. Place the exposed surface in direct contact with the mold. Apply controlled heat (e.g., 110–165 °C) and pressure to transfer the desired microstructure.

03

Punch Inlets

Punch inlet and outlet holes at the designated positions using a  puncher of appropriate diameter.

04

Place it

Bond the molded Flexdym™ layer with the chosen substrate (e.g., glass, PMMA, COC). Your Flexdym™ device is now ready for use.

Microfabrication Process with Flexdym™

microfluidics hot press Eden Tech

Classic Hot Press

Flexdym Pricing

Eden Tech has optimized Flexdym™’s pricing to be comparable to other widely used materials in microfluidics, with added advantages:

Application Notes, Case Studies & Top Flexdym™ Applications

Flexdym™ for Cell Study Devices

Top Flexdym Applications

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