MICROFLUIDICS FOR ALL SCALES
SOFT-LITHOGRAPHY
SCALE-UP KIT
The Soft-lithography Scale-Up Kit includes everything you need to bridge the gap between academia and industry by using Flexdym for microfluidic device fabrication.
MICROFLUIDICS FOR ALL SCALES
SOFT LITHOGRAPHY
SCALE-UP KIT
The Soft-lithography Scale-Up Kit includes everything you need to bridge the gap between academia and industry by using Flexdym for microfluidic device fabrication.
WHAT DOES THE KIT CONTAIN?
Your first stop towards scaling-up your microfluidic project
The kit contains: the Sublym hot embossing machine, a 35m Flexdym roll of your desired thickness (250um, 750um, 1200um and 2000um), the Epoxym mold solution for SU-8 mold replication, as well as a free refill and a free port puncher. With this kit you will be able to scale-up your device production from small scale to medium scale production with our user-friendly and efficient protocols.
WHAT DOES THE KIT CONTAIN?
Your first stop towards scaling up your microfluidic project.
The kit contains: the Sublym hot embossing machine, a 35m Flexdym roll of your desired thickness (250um, 750um, 1200um and 2000um), the Epoxym mold solution for SU-8 mold replication, as well as a free refill and a free port puncher. With this kit you will be able to scale-up your device production from small scale to medium scale production with our user-friendly and efficient protocols.
Flexdym
The Flexdym is the first biocompatible polymer which is also compatible with all scales of microfluidic device production.
Sublym
The Sublym hot embossing machine provides efficient microfluidic device replication & device assembly.
Epoxym
The Epoxym mold solution replicates expensive & fragile SU8 silicon wafers into robust epoxy resin molds.
Resin Refill
The kit includes a free resin refill, that allows you to fabricate 7 more molds of 5mm thickness & 4-inch diameter.
Puncher
The final component of the kit, metal puncher, for the creation of inlet and outlet ports.
STEP-BY-STEP CHIP FABRICATION PROCESS
Using the Point of Care Scale-up Kit make your microfluidics device ready for experiments in five easy steps!
STEP-BY-STEP CHIP FABRICATION PROCESS
Using the Point of Care Scale-up Kit, make your microfluidics device ready for experiments in five easy steps!
STEP I
MOLD REPLICATION
Using our Epoxym Mold Replication Solution, you can now replicate your expensive & fragile silicon wafer mold into robust epoxy resin mold.
STEP II
DEVICE REPLICATION
Replicate your design on the Epoxy mold onto Flexdym clips in less than 3 minutes using the Sublym hot embossing machine.
STEP III
DEVICE ASSEMBLY
Prepare your microfluidic device by placing Flexdym on your substrate. No harsh chemical treatment or temperature treatment is required.
STEP IV
DEVICE BONDING
Flexdym can bond to various materials like PS, PC, PMMA, COC, Glass, Silicon & itself. The bonding condition can be achieved in 1h at 80°C or in 24h at room temperature.
STEP V
CHIP-TO-WORLD SET UP
Create inlet & outlet ports in the device using puncher and stick Luer lock or olive adaptors on the chip using stick-on adhesive.
STEP I
MOLD REPLICATION
Using our Epoxym Mold Replication Solution, you can now replicate your expensive & fragile silicon wafer mold into robust epoxy resin mold.
STEP II
DEVICE REPLICATION
Replicate your design on the Epoxy mold onto Flexdym clips in less than 3 minutes using the Sublym hot embossing machine.
STEP III
DEVICE ASSEMBLY
Prepare your microfluidic device by placing Flexdym on your substrate. No harsh chemical treatment or temperature treatment is required.
STEP IV
DEVICE BONDING
Flexdym can bond to various materials like PS, PC, PMMA, COC, Glass, Silicon & itself. The bonding condition can be achieved in 1h at 80°C or in 24h at room temperature.
STEP V
CHIP-TO-WORLD SET UP
Create inlet & outlet ports in the device using puncher and stick Luer lock or olive adaptors on the chip using stick-on adhesive.
PRICING
The kit costs 10800 Euro. You would save more than 1000euros if you buy the kit instead of the products seperately.
Soft-Lithography Scale-up kit
1 Epoxym kit, 1 Sublym Machine, 35m Flexdym roll (250um, 750um, 1200um or 2000um thick), 1 free resin refill for Epoxym and 1 free Port Puncher.
PRICING
The kit costs 10800 Euro. You would save more than 1000euros if you buy the kit instead of the products seperately.
Soft-Lithography Scale-up kit
1 Epoxym kit, 1 Sublym Machine, 35m Flexdym roll (250um, 750um, 1200um or 2000um thick), 1 free resin refill for Epoxym and 1 free Port Puncher.
Get a 10% discount for Academic Researchers !
Get a 10% discount for Academic Researchers !
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