The Scale-Up Kit includes everything you need to get started with Flexdym for point-of-care device fabrication: the Sublym hot embossing machine, 4 Flexdym start packs, the Epoxym mold solution, 5 connector sets, and a port puncher. With this kit you will be able to scale-up your device production from small scale to medium scale production with our user-friendly and efficient protocols.
The Scale-Up Kit includes everything you need to get started with Flexdym for point-of-care device fabrication: the Sublym hot embossing machine, 4 Flexdym start packs, the Epoxym mold solution, 5 connector sets, and a port puncher. With this kit you will be able to scale-up your device production from small scale to medium scale production with our user-friendly and efficient protocols.
Your first stop towards successful point-of-care microfluidic device scale-up.
The Flexdym is the first biocompatible polymer which is also compatible with all scales of microfluidic device production.
The Sublym hot embossing machine provides efficient device replication & device assembly.
The Epoxym mold solution replicates expensive & fragile SU8 silicon wafers into robust epoxy resin molds.
Chip-to-world connection is an important component of device development. For this we provide luer or olive adaptors.
The final component of the kit, metal puncher, for the creation of inlet and outlet ports.
Your first stop towards successful point-of-care microfluidic device scale-up.
The Flexdym is the first biocompatible polymer which is also compatible with all scales of microfluidic device production.
The Sublym hot embossing machine provides efficient microfluidic device replication & device assembly.
The Epoxym mold solution replicates expensive & fragile SU8 silicon wafers into robust epoxy resin molds.
For the final device setup, we provide luer or olive adaptors for the chip-to-world connection.
The final component of the kit, metal puncher, for the creation of inlet and outlet ports.
Using the Point of Care Scale-up Kit make your microfluidics device ready for experiments in five easy steps!
Using the Point of Care Scale-up Kit, make your microfluidics device ready for experiments in five easy steps!
Using our Epoxym Mold Replication Solution, you can now replicate your expensive & fragile silicon wafer mold into robust epoxy resin mold.
Replicate your design on the Epoxy mold onto Flexdym clips in less than 3 minutes using the Sublym hot embossing machine.
Prepare your microfluidic device by placing Flexdym on your substrate. No harsh chemical treatment or temperature treatment is required.
Flexdym can bond to various materials like PS, PC, PMMA, COC, Glass, Silicon & itself. The bonding condition can be achieved in 1h at 80°C or in 24h at room temperature.
Create inlet & outlet ports in the device using puncher and stick Luer lock or olive adaptors on the chip using stick-on adhesive.
Using our Epoxym Mold Replication Solution, you can now replicate your expensive & fragile silicon wafer mold into robust epoxy resin mold.
Replicate your design on the Epoxy mold onto Flexdym clips in less than 3 minutes using the Sublym hot embossing machine.
Prepare your microfluidic device by placing Flexdym on your substrate. No harsh chemical treatment or temperature treatment is required.
Flexdym can bond to various materials like PS, PC, PMMA, COC, Glass, Silicon & itself. The bonding condition can be achieved in 1h at 80°C or in 24h at room temperature.
Create inlet & outlet ports in the device using puncher and stick Luer lock or olive adaptors on the chip using stick-on adhesive.
There are two price options available with and without Epoxym Mold Replication Kit
There are two price options available with and without Epoxym Mold Replication Kit
Do not hesitate to reach out. Just fill in the contact form here and we’ll be sure to reply within 2 working days
4 Rue de Rambervillers, Paris 75012
solutions@eden-tech-materials.com
